【摘要】 利用光学显微镜、X射线衍射（XRD）、电子背散射衍射（EBSD）技术、万能试验机等分析了轧制和热处理工艺对Cu-Sn-P合金带材晶粒尺寸、晶粒取向、组织分布和性能的影响，并建立了形变热处理工艺-带材微观组织-带材折弯性能之间的联系。结果表明：Cu-Sn-P合金带材先经过70%变形量的冷轧加工，再在650℃下进行走带速度为65 m·min^-1连续退火处理后，可将带材的变形加工组织与再结晶组织比例控制在5:1左右，带材的晶粒平均直径为3.5μm,且晶粒大小均匀。随后经15%冷轧变形和230℃保温3 h的低温去应力退火处理后，合金带材抗拉强度达到716 MPa,在垂直于带材轧制方向和平行于轧制方向分别进行180°折弯测试，带材表面在相对弯曲半径R/t≤1.5时均不开裂且无明显大褶皱。更多还原

【Abstract】 Effect of rolling and heat treatment processes on grain size, grain orientation, microstructure distribution and properties of Cu-Sn-P alloy strip was analyzed by means of optical microscope, X-ray diffraction（XRD）, electron backscatter diffraction（EBSD） technology and universal testing machine, and the relationship among thermomechanical treatment process, strip microstructure and strip bending properties was established. The results show that when the Cu-Sn-P alloy strip is first cold rolled with 70% deformation and then continuous annealing at 650 ℃ with a belt speed of 65 m·min^-1, the ratio of deformed microstructure to recrystallized microstructure of the strip can be controlled at about 5∶1, the average grain diameter of the strip is 3.5 μm, and the grain size is uniform. After 15% cold rolling deformation and low-temperature stress relief annealing at 230 ℃ for 3 h, the tensile strength of the alloy strip reaches 716 MPa. The results of 180° bending tests which were carried out perpendicular to and parallel to the rolling direction of the strip show that when the relative bending radius R/t≤1.5, the surface of the strip does not crack and has no obvious large folds.更多还原