【摘要】 集成电路从硅片制造、电路设计、晶圆加工、封装直到出厂存在近千道工艺，温度始终贯穿其中，温度的精密测量已成为不可或缺的关键技术。针对我国“缺芯少魂”的芯片产业发展困境及集成电路领域对于精密测温的迫切需求，展开传感器选型、长期稳定性考察及标定方法研究，发展多通道高精度测温电路技术，形成测温晶圆标定方法，研制了一套33路有线高精度晶圆温度测量系统。测试结果表明，NTC热敏电阻温度计能够满足高精度晶圆测温需求；拟合温度点的选取对于标定结果具有较大影响，通过不同标定温度点数量及分布的拟合结果比较，最终选取六点拟合，实现了21℃～23℃范围内偏差小于3 mK，测量不确定度7.4 mK(k=2)的结果。更多还原

【Abstract】 The process of integrated circuit fabrication spans from silicon wafer manufacturing, circuit designing, wafer processing, packaging to the final product, involving nearly a thousand steps where precision temperature control plays a pivotal role. Given the pressing demand for precise temperature measurements in integrated circuit production and the current challenges faced by China’s chip industry, this study investigated sensor selection, long-term stability, and calibration methods. Consequently, a multi-channel high-precision temperature measurement circuit technology was developed and a calibration method for temperature measurement wafers was established. Further, a 33-channel wired high-precision wafer temperature measurement system was constructed. Experimental results demonstrate that the NTC thermistor thermometer can satisfy the requirements of high-precision wafer temperature measurements. Calibration results greatly depend on the selection of fitting temperature points. Through comparison of different calibration temperature point distributions and quantities, a six-point fitting was chosen, achieving a deviation less than 3 mK within a 21℃～23℃ range, and measurement uncertainty of 7.4 mK(k=2).更多还原