【摘要】 焊料空洞作为焊接层缺陷，对IGBT模块功率循环寿命影响尚且未知，研究焊料寿命影响因素对于提高IGBT模块可靠性具有重要意义。考虑到IGBT模块制造过程中出现的工艺空洞具有随机大小和随机未知的特征，文章针对不同空洞率的双面散热IGBT模块开展同一试验条件下的功率循环试验。试验结果发现，空洞率越高，待测器件的功率循环寿命越短。为了揭示其影响原理，文章建立了具有不同空洞率的IGBT模块三维有限元模型，并且构建的空洞具有与实际工艺造成的空洞相符合的随机大小和随机位置的特征。通过有限元仿真发现，空洞率越高，焊料层和芯片的最高温度越高，引起的黏塑性应变越大，因此其功率循环寿命越短。基于功率循环试验和疲劳仿真结果，IGBT模块焊接层空洞率极限推荐值为3%，该研究成果可为IGBT模块焊料空洞筛选步骤提供参考。更多还原

【Abstract】 Studying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules,but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT module manufacturing process have random size and random unknown characteristics, power cycling tests were conducted under the same test conditions for double-sided cooled IGBT modules with different void ratios. The test results show that the higher the void ratio, the shorter the power cycling lifetime of the device under test. In order to reveal its influence mechanism, a three-dimensional finite element model of IGBT modules with different void ratios was established, and the voids built have random size and random position characteristics consistent with the actual process voids. Through finite element simulation, it is found that the higher the void ratio, the greater the maximum temperature of the solder layer and the chip, and the greater the viscoplastic strain caused, so the power cycling life is shorter. According to the power cycling test and fatigue simulation results, the recommended limit value for the void ratio of the IGBT module solder layer is 3%. The research results can provide guidance for the screening steps of solder voids of IGBT modules.更多还原