【摘要】 采用放电等离子烧结（SPS）对Al与FeNiCoCrMn高熵合金（HEA）及其六种子集（Ni、NiCo、FeNi、FeNiCo、NiCoCr、FeNiCoCr）进行固相扩散焊，探究了其扩散焊界面层微观组织、元素分布、相组成与显微硬度.结果表明，FeNiCoCrMn HEA对Al具有更好的扩散阻挡作用，其扩散焊界面层厚度最薄，仅为14.5μm.Ni、NiCo、FeNi的扩散焊界面生成金属间化合物（IMCs）以Al₃Ni-类型IMC为主，而FeNiCo、NiCoCr、FeNiCoCr、FeNiCoCrMn的扩散焊界面以Al₁₃Fe₄-类型IMC为主，且当Al₁₃Fe₄-类型IMC在界面IMC扩散层的占比越大，界面的软化效果越显著.FeNiCo合金与Al扩散焊界面软化效果最明显，界面硬度最低，仅为424 HV.更多还原

【Abstract】 Al was used for diffusion bonding with FeNiCoCrMn high-entropy alloy（HEA） and its six subsets（Ni、NiCo、FeNi、FeNiCo、NiCoCr、FeNiCoCr） by Spark Plasma Sintering（SPS）. The influences of chemical composition on the microstructure, element distribution and phase composition of the interfaces after bonding were investigated in detail, as well as the final microhardness. The results reveal that FeNiCoCrMn HEA had a better diffusion barrier effect on Al than its subsets, and the minimum thickness of the IMC diffusion layer after bonding with Al is only 14.5 μm. The intermetallic compounds（IMCs） generated at the interfaces of Ni, NiCo and FeNi after bonding were mainly Al₃Ni-type IMC, while the interfaces of FeNiCo, NiCoCr, FeNiCoCr and FeNiCoCrMn after bonding were mainly Al₁₃Fe₄-type IMC, and the greater the proportion of Al₁₃Fe₄-type IMC in their respective IMC diffusion layers, the more significant the softening effect of the interface. The interface softening effect of the FeNiCo alloy and Al after bonding was the most obvious, and the lowest interface hardness value was only of 424 HV.更多还原