【摘要】 半导体技术的进步使得功率器件面临更高的电压、功率密度和结温，这对功率器件的封装的可靠性提出了更高的要求.如何提高和检测功率器件的可靠性已经成为功率器件发展的重要任务.提升器件封装可靠性主要围绕优化封装结构、改进芯片贴装技术和引线键合技术3个方向研究.功率循环作为最贴近功率器件实际工况的可靠性测试方法，其测试技术、参数监测方法和失效机理得到广泛的研究.对功率器件封装结构、封装技术以及功率循环机理的相关研究进行了综述，总结了近年国内外的提升封装可靠性的方法，并介绍功率循环测试的原理和钎料层、键合线的失效机理，最后对于功率器件封装的未来发展趋势进行了展望.更多还原

【Abstract】 The progress of semiconductor technology has made power devices face higher voltage, power density and junction temperature, which puts forward higher requirements for the reliability of power device packaging. How to improve and detect the reliability of power devices has become an important task in the development of power devices. Improving packaging reliability mainly focuses on optimizing packaging structure, improving die attach technology and wire bonding technology. Power cycling, as a reliability testing method closest to the actual operating conditions of power devices, has been widely studied in terms of testing techniques, monitoring methods, and failure mechanisms. This paper provides a review of research on the packaging structure, packaging technology, power cycling mechanism of power devices and attempts to summarize the methods for improving packaging reliability at home and abroad in recent years. This review also discusses the principles of power cycling test and the failure mechanisms of solder layers and bonding wires. Finally, the future development trend of power device packaging was prospected.更多还原