【摘要】 通过一步法合成、降氯和分子蒸馏等工艺，制备了三种不同位点的高纯电子级萘基环氧树脂，分别为1,5-二羟基萘缩水甘油醚（1,5-DNGE）、1,6-二羟基萘缩水甘油醚（1,6-DNGE）和2,7-二羟基萘缩水甘油醚（2,7-DNGE）。通过控制环氧值、固化剂和固化程序一致性，分析了萘环上不同位点结构与性能的关系。选择聚醚胺（D230）和4-甲基六氢苯酐（MEHHPA）两种固化剂，研究了三种萘基环氧树脂的固化动力学，探究了萘环上不同位点的反应活性。研究结果表明：制备的三种不同位点的双官能度高纯萘基环氧树脂，三者纯度接近100%，总氯、水解氯和无机氯含量分别低于1 000、200和1 ppm，适用于电子级环氧树脂的要求；在D230体系中，1,6-DNGE活化能最低，而在MEHHPA体系中，2,7-DNGE活化能最低。由于1,5-DNGE和2,7-DNGE的分子结构更对称，交联度高，所以玻璃化转变温度、橡胶弹性模量、交联密度、线膨胀系数、介电和热失重数据都较1,6-DNGE更优异；1,6-DNGE却具有最高的储能模量[E’(50℃)>2 600 MPa]、损耗模量（tanδ>1.1）和韧性，加工性能更好，非常适合制备综合性能优异的复合材料，为电子封装行业提供了综合性能优异的高纯电子级萘基环氧树脂和应用价值。更多还原

【Abstract】 Three kinds of high-purity electronic grade naphthyl epoxy resin with different sites were prepared by one-step synthesis,dechlorination and molecular distillation process,which were 1, 5-dihydroxynaphthalene glycidyl ether(1,5-DNGE),1,6-dihydroxynaphthalene glycidyl ether(1,6-DNGE)and 2,7-dihydroxynaphthalene glycidyl ether(2,7-DNGE).By controlling the consistency of epoxy value,curing agent and curing procedure,the relationship between the structure and properties of different sites on the naphthalene ring was analyzed. Two curing agents,i. e. polyether amine(D230)and 4-methylhexahydrophthalic anhydride(MEHHPA)were selected to study the curing kinetics of three kinds of naphthyl epoxy resin,and the reactivity of different sites on the naphthalene ring was investigated as well.The research results showed that the three bifunctional high-purity naphthyl epoxy resin prepared with different sites had nearly 100% purity,with the total chlorine,hydrolyzed chlorine,and inorganic chlorine contents below 1 000,200,and 1 ppm,respectively,which were suitable for the requirements of electronic grade epoxy resin. In the D230 system,the activation energy of 1, 6-DNGE was the lowest,while in the MEHHPA system,the activation energy of 2, 7-DNGE was the lowest. Since the molecular structure of 1,5-DNGE and 2,7-DNGE was more symmetrical and the crosslinking degree was high,thus the glass transition temperature,rubber elastic modulus,crosslinking density,coefficient of linear expansion,dielectric and thermal weight loss data were better than those of 1, 6-DNGE. 1, 6-DNGE had the highest storage modulus[E’(50 ℃)>2 600 MPa],loss modulus(tanδ>1.1)and toughness,the processing performance was better,which was very suitable for preparing composite materials with excellent comprehensive performance,providing high-purity electronic grade naphthyl epoxy resin with excellent comprehensive performance and application value for the electronic packaging industry.更多还原