【摘要】 封装天线（AiP）是一种能够实现低成本制备、高性能以及小体积天线的技术，在移动通信等领域有着广泛的应用。在扇出型晶圆级封装（FOWLP）中，采用通孔工艺能够实现电信号的垂直互连结构，助力AiP技术的发展。重点阐述了FOWLP工艺中硅通孔（TSV）、玻璃通孔（TGV）和塑封通孔（TMV）的制备方法，以及通过3种通孔技术实现的垂直互连结构在封装天线领域的应用。采用这3种垂直互连结构制备的封装天线能够实现三维集成，从而更进一步地缩小天线的整体封装体积。介绍了3种通孔的制备工艺，以及采用通孔技术的FOWLP工艺在封装天线领域的应用。明确了每一种垂直互连结构应用于AiP的优缺点，为FOWLP工艺在AiP领域中的技术开发和探索提供参考。更多还原

【Abstract】 Antenna in package(AiP) is a technology that can realize the fabrication of low-cost,high-performance and small size antenna, and has a wide range of applications in mobile communication and other fields. In fan-out wafer-level packaging(FOWLP), the through-via process can realize the vertical interconnection structure for electrical signals, supporting the development of AiP technology. The preparation methods of through silicon via(TSV), through glass via(TGV) and through mold via(TMV) in FOWLP process, as well as the application of vertical interconnection structures realized by the three through-via technologies in the field of AiP are mainly described. The packaged antennas prepared by these three vertical interconnection structures can achieve three-dimensional integration, thus further reducing the overall package volumes of the antennas. Three preparation processes for through-via and the application of FOWLP process using through-via technology in the field of AiP are introduced. The advantages and disadvantages of each vertical interconnection structure applied in AiP are clarified, which can provide a reference for the technical development and exploration of FOWLP technology in the AiP field.更多还原