【摘要】 针对目前掩膜电解加工深度溶解能力受限问题，以微凹坑阵列为研究对象，提出了基于流体动压效应的扫描阴极掩膜电解加工新方法。利用高流速电解液冲刷微凹坑表面堆积的电解产物，提高深度溶解能力，并且借助扫描阴极射流产生的流体动压效应使掩膜与工件表面动态贴合，从而简化工艺装置设计。基于加工试验，探讨了不同平底阴极结构和加工参数耦合作用对微凹坑尺寸变化的影响，最终实现直径259.8μm、深度44.1μm和直径418.1μm、深度102.7μm微凹坑阵列的加工，论证了扫描阴极掩膜电解加工方法具有提高深度溶解的能力。更多还原

【Abstract】 A new scanning cathode through-mask electrochemical machining method based on fluid dynamic pressure effect was proposed to address the current problem of limited deep dissolution ability in through-mask electrochemical machining,with micro-dimple arrays as research object.Utilizing high flow rate electrolyte to flush the electrolytic products accumulated on the surface of micro pits,the deep dissolution ability was improved and the fluid dynamic pressure effect generated by scanning cathode jet was utilized to dynamically fit the mask and workpiece surface,thus simplifying the design of process equipment. Based on experiments,the influence of coupling effects of different flat bottom cathode structures and processing parameters on the size variation of micro-dimple arrays was explored. Finally,the fabrication of arrays with a diameter/depth of 259.8 μm/44.1 μm and a diameter/depth of 418.1 μm/102.7 μm were realized respectively,which demonstrated that the scanning-cathode method could improve the deep dissolution capability.更多还原