【摘要】 为了提高电解铜箔的剥离强度，先研究了单独添加钼酸钠、羟乙基纤维素(HEC)和聚二硫二丙烷磺酸钠(SPS)对铜箔粗化效果的影响，再通过正交试验对3种添加剂进行复配，得到较佳的复合添加剂──50 mg/L钼酸钠+5 mg/L SPS+3 mg/L HEC。采用该复合添加剂时，铜箔在电流密度25 A/dm~2、温度35℃的条件下粗化1次，再固化2次后毛面粗糙度(Rz)为7.57μm，剥离强度为1.53 N/mm，劣化率为0。更多还原

【Abstract】 The effects of different additives i.e. sodium molybdate, hydroxyethyl cellulose(HEC), and bis-(sodium sulfopropyl)-disulfide(SPS) on the roughening of electrolytic copper foil were studied to improve its peeling strength. A composite additive comprising 50 mg/L sodium molybdate, 5 mg/L SPS, and 3 mg/L HEC was determined by orthogonal test. After roughening in the electrolyte containing the optimized composite additive at current density 25 A/dm~2 and temperature 35 ℃ once followed by curing twice, the surface roughness(Rz) at matte side of the electrolytic copper foil was 7.57 μm. The copper foil featured a peeling strength of 1.53 N/mm and a zero degradation rate.更多还原