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极间距和工作电压对阳极屏蔽电沉积铜定域性的影响
Effects of interelectrode gap and operating voltage on localized electrodeposition of copper using shielding anode
【摘要】 设计并制作了阳极屏蔽电沉积系统,采用5,5-二甲基乙内酰脲(DMH)体系镀铜液,在温度(23.5±1)℃下电沉积30 s,研究了极间距和工作电压的变化对定域电沉积效果的影响。结果表明,阳极屏蔽定域沉积区域随极间距和工作电压的增大而扩大,且极间距变化对沉积图案定域性的影响大于工作电压变化带来的影响。
【Abstract】 Localized electrodeposition of copper was conducted in a 5,5-dimethylhydantoin(DMH) bath at temperature(23.5 ± 1) ℃ for 30 s using a home-designed electrodeposition system with a shielding anode. The effects of interelectrode gap and operating voltage on the localized electrodeposition were studied. The results showed that the localized deposition region when using a shielding anode expands with the increasing of interelectrode gap or operating voltage. The variation in interelectrode gap has greater impact on the localized deposition area than the variation in operating voltage.
【Key words】 copper; localized electrodeposition; shielding anode; interelectrode gap; operating voltage; 5,5-dimethylhydantoin;
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2023年01期
- 【分类号】TQ153.14
- 【下载频次】5