【摘要】 为了研究具有亚微米组分的钼铜粉末烧结时的晶间反应机制,采用亚微米活化层法制备了一种具备晶间反应层的钼铜复合材料。采用X射线衍射仪(XRD)、扫描电镜(SEM)、能谱仪(EDS)、透射电镜(TEM)、高分辨透射电镜(HRTEM),对Mo-15Cu合金组织形貌、连接和结构特征进行了表征。研究了亚微米活化层对钼铜复合材料晶间反应的影响。结果表明,添加8%(质量分数)亚微米粉,可形成厚度约0.5μm纳米活化层。Mo亚微米颗粒通过流动、扩散,改变晶间反应机制,形成了真正意义上的晶间反应层,厚度约为5 nm,实现了冶金结合。更多还原

【Abstract】 In order to investigate the intergranular reaction mechanism during sintering of molybdenum-copper powders with submicron components, a Mo-15Cu composite with an intergranular reaction layer was prepared by a submicron-activated layer method. The histomorphology, connectivity and structural characteristics of Mo-15Cu alloy were characterized by X-ray diffractometer(XRD), scanning electron microscope(SEM), energy dispersive spectrometer(EDS), transmission electron microscope(TEM), and high-resolution transmission electron microscope(HRTEM). The effect of submicron-activated layers on the intergranular reaction of Mo-15Cu composites was investigated. The results show that the submicron-activated layer with a thickness of 0.5 μm is formed by adding 8wt% submicron powder. The submicron-sized Mo particles change the intergranular reaction mechanism through flow and diffusion, forming an intergranular reaction layer with a thickness of about 5 nm and achieving metallurgical bonding.更多还原