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Direct visualization of structural defects in 2D semiconductors

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【作者】 郭玉拓王琴琴李晓梅魏争李璐彭雅琳杨威杨蓉时东霞白雪冬杜罗军张广宇

【Author】 Yutuo Guo;Qinqin Wang;Xiaomei Li;Zheng Wei;Lu Li;Yalin Peng;Wei Yang;Rong Yang;Dongxia Shi;Xuedong Bai;Luojun Du;Guangyu Zhang;Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences;School of Physical Science, University of Chinese Academy of Sciences;Songshan-Lake Materials Laboratory;

【通讯作者】 张广宇;

【机构】 Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of SciencesSchool of Physical Science, University of Chinese Academy of SciencesSongshan-Lake Materials Laboratory

【摘要】 Direct visualization of the structural defects in two-dimensional(2D) semiconductors at a large scale plays a significant role in understanding their electrical/optical/magnetic properties, but is challenging. Although traditional atomic resolution imaging techniques, such as transmission electron microscopy and scanning tunneling microscopy, can directly image the structural defects, they provide only local-scale information and require complex setups. Here, we develop a simple, non-invasive wet etching method to directly visualize the structural defects in 2D semiconductors at a large scale,including both point defects and grain boundaries. Utilizing this method, we extract successfully the defects density in several different types of monolayer molybdenum disulfide samples, providing key insights into the device functions. Furthermore, the etching method we developed is anisotropic and tunable, opening up opportunities to obtain exotic edge states on demand.

【Abstract】 Direct visualization of the structural defects in two-dimensional(2D) semiconductors at a large scale plays a significant role in understanding their electrical/optical/magnetic properties, but is challenging. Although traditional atomic resolution imaging techniques, such as transmission electron microscopy and scanning tunneling microscopy, can directly image the structural defects, they provide only local-scale information and require complex setups. Here, we develop a simple, non-invasive wet etching method to directly visualize the structural defects in 2D semiconductors at a large scale,including both point defects and grain boundaries. Utilizing this method, we extract successfully the defects density in several different types of monolayer molybdenum disulfide samples, providing key insights into the device functions. Furthermore, the etching method we developed is anisotropic and tunable, opening up opportunities to obtain exotic edge states on demand.

【基金】 Project supported by the Key-Area Research and Development Program of Guangdong Province, China (Grant No. 2020B0101340001);the Strategic Priority Research Program of Chinese Academy of Sciences (CAS) (Grant No. XDB30000000);the National Natural Science Foundation of China (Grant Nos. 61888102 and 11834017)
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2022年07期
  • 【分类号】TN303
  • 【下载频次】6
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