【摘要】 为了提高汽车电子焊料的可靠性，研究了添加一维纳米线对焊料金属间化合物（IMCs）形貌及厚度的影响。通过添加不同长径比的纳米银线（AgNWs）,制备了SAC3005-xAgNWs复合焊点。采用扫描电子显微镜（SEM）观察纳米银线的表面形貌，采用金相显微镜观察焊点的显微组织。结果表明：PVP与硝酸银摩尔比为6.0时，合成的纳米银线长径比和均匀性更好，d=30 nm,L=4～20μm;随着时效时间的延长，Cu₆Sn₅ IMCs出现平面化现象；添加纳米银线可以抑制Cu₆Sn₅ IMCs生长，抑制作用随着纳米银线长径比增大而减弱，d=80 nm,L=4～23μm时抑制效果最好。这是由于Ag原子和Sn原子的化学亲和力高于Sn原子和Cu原子的化学亲和力，添加纳米银线，Ag原子浓度增加，生成更多的Ag₃Sn IMCs抑制Cu₆Sn₅ IMCs的生长，纳米银线长径比增大容易发生团聚、打结，扩散速率减慢，抑制作用减弱。更多还原

【Abstract】 In order to improve the reliability of automotive electronic solders, the effect of adding one dimension nanowires on the morphology and thickness of solder intermetallic compounds（IMCs）was studied.SAC3005-xAgNWs composite solder joints were prepared by adding silver nanowires（AgNWs）with different aspect ratios.Scanning Electron Microscope（SEM） was used to characterize the surface morphology of silver nanowires, and metallographic microscope was used to observe the microstructure of solder joints.The results showed that when the molar ratio of PVP to silver nitrate was 6.0,the length diameter ratio and uniformity of the synthesized silver nanowires were better, d=30 nm, L=4～20 μm; With the prolongation of aging time, Cu₆Sn₅ IMCs appear planarization; The addition of silver nanowires can inhibit the growth of Cu₆Sn₅ IMCs.The inhibition decreases with the increase of the aspect ratio of silver nanowires.The inhibition effect is best when d=80 nm and L=4～23 μm, which is because the chemical affinity of Ag atoms and Sn atoms is higher than that of Sn atoms and Cu atoms.When silver nanowires are added, the concentration of Ag atoms increases, and more Ag₃Sn IMCs are generated to inhibit the growth of Cu₆Sn₅ IMCs.When the length diameter ratio of silver nanowires increases, agglomeration and knotting easily occur, the diffusion rate slows down, and the inhibition is weakened.更多还原