【摘要】 由于传统气密封装方法在封装的过程中会给电子器件带来不利的影响，本文基于银焊膏电流烧结快速互连技术，提出了一种新型的气密封装方法，可用于航天功率分立器件的密封。本文研究了通电过程中接头温度、微观形貌以及剪切强度的变化。在银焊膏电流烧结的过程中，随着有机物的去除，烧结银层升温速率急剧下降，并且最初被有机物分离的银颗粒逐渐相互接触。随着通电时间延长，烧结银接头越来越致密，伴随着接头强度的不断提高。最终获得的烧结银密封接头可以满足封装器件对气密性的要求。更多还原

【Abstract】 Due to the traditional hermetic packaging methods would have adverse effects on electronic devices during the packaging process,a new hermetic packaging method based on current assisted sintering of silver paste was proposed,which can be used for the hermetic sealing of the aerospace power discrete device. In this paper,the changes of temperature,microstructure and shear strength of the sintered joint during the process of current assisted sintering of silver paste have been studied. During the process of current assisted sintering of silver paste,the heating rate drops dramatically after the removal of organics. It facilitates the initially separated silver particles to contact with each other. With the prolongation of current-on time,the sintered silver joint becomes denser,which leads to the improvement of shear strength of sintered silver joint. Finally,the sealing performance of sintered joint can meet the requirements of hermeticity.更多还原