【摘要】 随着5G通信技术的发展，通信频段的演进对于声学滤波器的性能指标、封装尺寸、集成度等要求越来越高。但在小尺寸的声表面波双工器中，隔离度指标是设计中的一个难点。该文针对如何提高双工器隔离度指标展开研究。基于耦合模模型与电磁仿真模型建立了双工器的仿真模型。通过采用拓扑结构的改进、共地电感与封装外壳的改进等方法，最终实现了在发射端(Tx)隔离度为-60.5 dB,接收端(Rx)隔离度为-50 dB,且具有小插入损耗特征的Band 5双工器设计，较之未改进前的双工器，其隔离度有明显改善。更多还原

【Abstract】 With the development of 5G communication technology, the evolution of communication frequency bands has higher and higher requirements on the performance specifications, package size, and integration of acoustic filters. However, the isolation index is a difficulty point in the design of small-sized surface acoustic wave(SAW) duplexers. This paper studies how to improve the isolation of the duplexer. Based on the Coupling-of-Mode(COM) and the electromagnetic simulation model, a simulation model of the duplexer is established. By improving the topology structure, the common ground inductance and package, etc., finally, the design of a Band 5 duplexer with -60.5 dB of isolation at the Tx end and -50 dB of isolation at the Rx end, small insertion loss has been realized. Comparing with the unimproved duplexer, the isolation of the proposed one has been significantly improved.更多还原