【摘要】 采用有限元分析方法构建集成芯片的PCB散热模型，探讨了对流方式、空气对流系数、导热层材料对PCB散热性能的影响。结果表明，与自然对流方式相比，强制对流作用下，PCB表面温度更早趋于稳定。加大空气对流系数有利于提高PCB散热性能。PCB热设计时，嵌入金属-非金属相结合的材料作为导热层，是提高PCB产品散热的有效方法。更多还原

【Abstract】 The PCB heat dissipation model with integrated chip was constructed by finite element analysis method. The effects of convection mode,air convection coefficient and thermal conductive layer material on heat dissipation performance of PCB were discussed. The results show that the surface temperature of PCB tends to stabilize earlier under forced convection than that under natural convection. Increasing air convection coefficient is beneficial to improve the heat dissipation performance of PCB. During PCB thermal design,embedding metal-nonmetal materials as heat conducting layer is an effective method to improve the heat dissipation of PCB products.更多还原