【摘要】 针对电子芯片的散热问题，采用拓扑优化方法，设计了包含针肋结构的水冷微通道的优化结构。为了获得最佳散热性能，采用材料属性的有理近似方法，以平均温度和流动能量耗散最小为目标，构建了数学优化模型。基于非结构网格，采用间断Galerkin有限元法结合全局收敛移动渐近线方法求解了三维微通道热沉的对流传热耦合优化问题。数值结果表明，优化结构具有良好的传热性能，且结构温度更均匀，避免了高温集中区的发生。在体积流量相同的情况下，与光滑矩形通道和针肋矩形直通道相比，优化结构的综合传热效率分别提高了13.32%和12.30%。更多还原

【Abstract】 With the author of the paper focusing on the heat dissipation of electronic chips, the optimal structure of water-cooled microchannel heat sink with pin-fin structure was designed with the topology optimization method. To obtain the best heat transfer performance, a mathematical optimization model was established to minimize the average temperature and the flow energy dissipation with the rational approximation of material properties method. Based on unstructured grids, the coupled optimization problem of convection and heat transfer for the three-dimensional microchannel heat sink was solved with discontinuous Galerkin finite element method and the globally convergent method of moving asymptote. The numerical results show that the optimized structure has good heat transfer performance, and the structure temperature is more uniform, which avoids the occurrence of high temperature concentration area. Under the same volume flow rate, in comparison with the smooth rectangular channel and rectangular straight channel with pin-fin pattern, the comprehensive heat transfer efficiency of the optimized structure is increased by 13.32% and 12.30% respectively.更多还原