【摘要】 化学机械抛光(chemical mechanical polishing,CMP)技术和超精密晶圆减薄技术是超大规模集成电路晶圆制造工艺流程中的两大关键技术。本文简述了近年来国内集成电路制造领域中化学机械抛光设备和超精密晶圆减薄设备的相关研究。一方面,从抛光头、抛光垫修整装置、终点检测装置、清洗装置4个CMP设备的核心部件,以及抛光垫和抛光液2个CMP关键耗材出发,总结归纳了国内外化学机械抛光设备的最新研究进展;另一方面,从超精密晶圆减薄技术的原理出发,对超精密晶圆减薄设备在国内的应用现状进行了总结。更多还原

【Abstract】 Chemical mechanical polishing(CMP) and ultra-precision wafer thinning grinding are considered as the two key technologies in the manufacturing of integrated circuits. The research on CMP equipment and ultra-precision wafer thinning grinder in domestic has been carried out. From the point of four CMP core components including polishing head, conditioner device, end point detection device, cleaning module, as well as two CMP key consumables including polishing pad and slurry, the latest research progress on CMP equipment from academic circles and industries were summarized. Moreover, based on the principle of ultra-precision wafer thinning grinding, the applications of ultra-precision thinning grinder in domestic was discussed.更多还原