节点文献
“三维度虚实结合”的集成电路专业实践教学研究
Research on the Practice Teaching System with “Three-dimensionality Virtual-Actual Combination” of Integrated Circuit Major
【摘要】 集成电路产业工程性强、行业门槛高、专业背景要求高,人才培养周期长,而地方院校虽然工科生人数多,但存在专业水平层次差异大、实践能力弱等问题,导致了集成电路产业人才极度短缺的现象。结合地方院校特点,采用“课堂支撑、技术赋能、赛创进阶”的“三维度虚实结合”实践教学体系,以“认识芯片—使用芯片—设计芯片”的全流程芯片实践训练过程,分层次循序渐进地实施集成电路专业人才的实践能力培养,以提升学生集成电路专业工程实践能力。实践表明,该教学体系是地方院校培养高层次工程人才的有效方法。
【Abstract】 The integrated circuit industry has strong engineering capabilities, high level of industry biology, high professional background requirements, and a long talent training cycle. Although local colleges and universities have a large number of engineering students, there are problems such as large differences at different levels and weak practical ability, which have caused an extreme shortage of talents in the integrated circuit industry. This article is oriented to local colleges and universities, presents the practical teaching system of “virtual and real combined three-dimensionality” of “ supporting with class, empowering with technology, enhancing with competition and innovation”. According to the whole process of “understanding the chip to using the chip to designing the chip”, implementing the practice ability training of integrated circuit major step by step and improving students’ professional engineering practice ability, this paper summarizes new ideas for improving engineering students’ engineering practical ability in the actual teaching process. The results show that the engineering practice ability of students has been greatly improved, and it provides a certain guiding significance for improving the comprehensive practical ability of students under the background of new engineering.
【Key words】 integrated circuit; virtual and real combined three-dimensionality; emerging engineering; practice teaching;
- 【文献出处】 实验室研究与探索 ,Research and Exploration in Laboratory , 编辑部邮箱 ,2022年03期
- 【分类号】G642.0;TN40-4
- 【下载频次】100