【摘要】 通过选用扫描电子显微镜结合X射线能量谱分析和XPS能谱分析配合平行成像技术，对印制电路板表面沾污进行分析，测量结果存在较大差异。通过设计氩离子刻蚀清洁样品表面实验对两种方法的测量结果差异性进行分析，结果表明，印制电路板表面沾污主要来源于样品表层污染。因此，两种分析技术中具有表面分析功能的XPS能谱分析配合平行成像技术更具优势，可以较为准确地探测表面污染元素的种类、含量以及各污染元素在样品表面的分布状况，对查找器件失效原因具有指导意义，值得推广和应用。更多还原

【Abstract】 By using scanning electron microscopy combined with energy dispersive spectroscopy analysis and XPS analysis combined with parallel imaging technology, the surface contamination of the printed circuit board is analyzed, and the measurement results are quite different. Through the design of argon ion etching cleaning sample surface experiment to analyze the difference in the measurement results of the two methods, it is investigated that the surface contamination of the printed circuit board mainly comes from surface pollution, so the XPS with surface analysis function in the two analysis technologies has more advantages, and can more accurately detect the types and content of surface pollution elements and the distribution of each polluting element on the sample surface,which is of guiding significance for finding out the cause of device failure,and is worth promoting and applying.更多还原