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粘接装夹条件下薄壁平面件应力变形预测

Prediction of Stress Deformation of Thin-walled Wafer Parts under the Bonding Clamping Condition

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【作者】 孙辉闫舒洋齐书韬孙玉文

【Author】 SUN Hui;YAN Shuyang;QI Shutao;SUN Yuwen;School of Mechanical Engineering, Dalian University of Technology;

【机构】 大连理工大学机械工程学院

【摘要】 应用于精密物理实验的薄壁平面构件具有径厚比大、刚性差等特点,加工过程中极易在应力的作用下产生较大的变形。为提高薄壁平面件的制造精度,文中首先提出了一种基于局部粘接的低应力装夹策略,并给出了局部粘接装夹稳定性判定方法,考虑材料非均匀去除过程,建立了薄壁平面件精密加工多次切削变形预测模型,最后通过实验验证了模型的准确性。

【Abstract】 With the characteristics of large diameter-to-thickness ratio and weak rigidity, thin-walled wafer parts used in precision physics experiments are prone to generate large deformation during machining under the effect of the stress. In order to improve the manufacturing accuracy of thin-walled wafer parts, this paper proposes a low-stress clamping strategy based on local bonding and the method of determining the stable clamping. Considering the non-uniform removal process of materials, the prediction model of multi-cutting deformation in precision machining of thin-walled wafer parts is established. Finally, the accuracy of the model is verified by experiments.

  • 【文献出处】 机械工程师 ,Mechanical Engineer , 编辑部邮箱 ,2022年01期
  • 【分类号】TG51
  • 【下载频次】131
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