【摘要】 以硼质量分数为0.5%的Cu–B合金为金属基体以及平均粒径为500μm的金刚石颗粒为增强体，采用气压熔渗法制备金刚石/Cu–B合金复合材料，研究气压参数对其组织结构和热物理性能的影响规律。结果表明：随着气压升高，金刚石与Cu–B合金之间的界面结合效果、导热性能均增强，热膨胀系数减小；当气压为10 MPa时，其界面结合效果最优，界面处生成的碳化物层将金刚石完全覆盖，且100℃时的样品热导率为680.3 W/（m·K），热膨胀系数为5.038×10^-6 K^-1，满足电子封装材料的热膨胀系数要求。更多还原

【Abstract】 The Cu–B alloy with boron mass fraction of 0.5% was used as the metal matrix, and the diamond with an average particle size of 500 μm was used as reinforcement, the diamond/Cu–B alloy composites were prepared by gas pressure infiltration method. The effects of gas pressure parameters on the microstructures and the thermophysical properties of the composites were studied. The results show that the interfacial bonding effect and the thermal conductivity between diamond and Cu–B alloy are enhanced and the thermal expansion coefficient is reduced with the increase of gas pressure. When the gas pressure is 10 MPa, the interfacial bonding effect is the best. The carbide layer formed at the interface completely covers the diamond, the thermal conductivity of the sample at 100 ℃ is 680.3 W/（m·K）, and the thermal expansion coefficient is 5.038×10^-6 K^-1, which meets the thermal expansion coefficient requirements of electronic packaging materials.更多还原