【摘要】 为了研究环烯烃类共聚物(COC)微流控芯片热压键合工艺，设计了以STM32单片机为硬件平台的温度控制系统。该系统搭载FreeRTOS多任务操作系统，使用热敏电阻NTC为测温元件，温度数据处理采用巴特沃斯低通滤波，采用模糊增量式PID控制算法，以脉冲宽度调制PWM对半导体制冷片进行温度控制，实现了在键合工艺温度75～85℃内的精准控温。系统超调量在1%以内，升温速率为0.50℃/s以上，降温速率为0.34℃/s以上，控温精度为±0.3℃。更多还原

【Abstract】 In order to study the hot pressing bonding process of cycloalkene copolymer(COC)microfluidic chip, a temperature control system based on STM32 MCU was designed. The system was equipped with FreeRTOS multitask operating system, thermistor NTC was used as temperature sensor, Butterworth low-pass filter was used for temperature data process, fuzzy incremental PID control algorithm was used, and pulse width modulation PWM was used for temperature control of semiconductor refrigeration chip, then accurate temperature control in bonding process temperature of 75～85 ℃ was realized. The overshoot of the system is less than 1%, the heating rate is above 0.50 ℃/s, and the cooling rate is above 0.34 ℃/s. The temperature control accuracy reaches ±0.3 ℃.更多还原