【摘要】 采用羟基化结合硅烷偶联剂（KH560）对氮化硅（Si₃N₄）粉体进行表面功能化改性，配制出高固含量、高固化深度的Si₃N₄膏料，并基于立体光固化（SL）工艺制备了高强度的Si₃N₄复杂结构件。结果表明：Si₃N₄表面的KH560改善了粉体与树脂的相容性，降低了Si₃N₄膏料的粘度；同时，KH560的环氧基团（—CH（O）CH₂）与环氧树脂（EA）通过化学键等方式相结合，形成了EA核壳结构，降低了树脂与陶瓷颗粒之间的折射率差，从而提高了Si₃N₄膏料的固化深度。表面羟基化处理后Si₃N₄表面吸附了更多的KH560,从而进一步降低了Si₃N₄膏料的粘度，提高了Si₃N₄膏料的固化深度。最终，用羟基化和KH560改性后的Si₃N₄粉体配制出的Si₃N₄膏料固含量达到50%（体积分数）,固化深度达到64μm。烧结后Si₃N₄试样致密度为83%,断裂韧性为（4.38±0.45） MPa·m^1/2,抗弯强度达到（407.95±10.50） MPa。更多还原

【Abstract】 The surface of silicon nitride（Si₃N₄） powder was functionally modified by hydroxylation combined with silane coupling agent（KH560） to prepare Si₃N₄ paste with high solid content and high curing depth. High strength Si₃N₄ complex structures based on stereolithography（SL） process were fabricated. The results show that KH560 on the surface of Si₃N₄ improves the compatibility of powder and resin, and reduces the viscosity of Si₃N₄ paste. At the same time, the epoxy group（—CH（O）CH₂） of KH560 is combined with epoxy resin（EA） through chemical bonds or other ways to form an EA core-shell structure, which reduces the refractive index difference between the resin and ceramic particles. Thus, the curing depth of Si₃N₄ paste is improved. After the surface hydroxylation treatment, more KH560 is adsorbed on the surface of Si₃N₄, which further reduces the viscosity of Si₃N₄ paste and increases the curing depth of Si₃N₄ paste. Finally, the Si₃N₄ paste prepared with hydroxylated and KH560 modified Si₃N₄ powder has a solid phase content of 50%（volume fraction） and a curing depth of 64 μm. After sintering, the density of Si₃N₄ sample is 83%, the fracture toughness is（4.38±0.45） MPa·m^1/2, and the flexural strength reaches（407.95±10.50） MPa.更多还原