【摘要】 基于硅基三维集成模块和印制板(Printed Circuit Board,PCB)混压工艺，设计了一种小型化Ku波段收发组件，并对其原理方案和具体实现进行了介绍。该收发组件整体电路采用三维集成架构实现，射频及中频芯片和其外围电路集成于硅基三维集成模块中，外部电路板采用射频与低频混压印制板，模块和印制板通过球栅阵列(Ball Grid Array, BGA)互联。通过对信号过渡结构进行优化设计，降低了信号传输损耗，提升了通道间隔离度。电路测试表明，组件在工作频带内满足通道间幅度一致性、带内平坦度、噪声系数等指标要求，且符合组件小型化、高集成度、高一致性、高可生产性的现实需求。更多还原

【Abstract】 With silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D in-tegrated structure. Radio frequency(RF) and intermediate frequency(IF) chips and their periphery circuits were integrated in 3D het-erogeneous integrated module. Outer circuit board was made of a mixed-laminated multi-layer PCB. The transceiver used ball grid array( BGA) to connect 3D module and PCB. Signal transmission structure was optimized to reduce transmission loss and improve isolation among the channels. Product test indicates that the transceiver meet the requirements of inter-channel amplitude consisten-cy, intra-band flatness, noise factor and other indicators. Besides, the transceiver has conformed to practical needs such as minia-turization, high integration, high consistency and high producibility.更多还原