节点文献
基于IGBT结温波动平滑控制的主动热管理方法综述
Review on Active Thermal Control Methods Based on Junction Temperature Swing Smooth Control of IGBTs
【摘要】 IGBT作为功率变流器的核心器件,被广泛应用于电动汽车、轨道交通、航空航天和电力系统等领域,由于功率变流器的运行环境复杂多变,处理功率大幅波动,导致IGBT内部结温发生剧烈变化,器件在热应力持续作用下引起疲劳老化失效,进而影响系统运行可靠性的问题已受到业界的普遍关注和高度重视。近年来,国内外学者围绕如何通过内部热管理来平抑功率器件的结温波动、延长运行寿命展开了大量的研究工作,从不同的角度提出各种主动热管理方法,这对延缓功率器件疲劳老化速率、提升器件运行可靠性有着重要意义。该文分别从功率器件层面和变流器运行控制层面系统性地阐述和归纳现有IGBT主动热管理方法的原理和特点,并基于IGBT器件寿命评估模型对各类主动热管理方法的效果进行量化评估,从热应力缓解程度、实现难度、寿命延长倍数和适用范围等多角度进行综合对比分析,并对IGBT器件主动热管理方法的进一步研究提出建议,为IGBT器件健康管理和运行可靠性的提升提供参考意义。
【Abstract】 Served as core devices in power converters, IGBT devices are used in electric vehicles,rail transit, aerospace, and power systems. However, the junction temperature of IGBT devices swings dramatically due to the harsh operating environment. Hence, under the continuous impact of thermal stress, IGBT devices suffer degradations, which affects the reliability of system ope ration. At present,domestic and foreign scholars have carried out a lot of research work regarding internal thermal management to extend the operating lifetime. Simultaneously, various active thermal management methods have also been proposed, which are of great significance to delay the aging rate of power devices and improve the reliability of systems. Firstly, this paper clarifies and summarizes the principles and characteristics of the existing methods of active thermal control for IGBTs from the perspective of device level and the system level respectively. Secondly, the effects of the active thermal control methods based on the lifetime evaluation model of IGBTs are evaluated quantitatively. Finally,these methods are comprehensively compared and analyzed from the mitigated degree of the thermal stress, the difficulty of realization, the degree of the lifetime extension and the scope of the application.And the exploration direction of the active thermal control for IGBT devices is prospected, which provides a meaningful reference for the health management of IGBT devices.
【Key words】 Active thermal control; junction temperature smoothing; loss control; reliability;
- 【文献出处】 电工技术学报 ,Transactions of China Electrotechnical Society , 编辑部邮箱 ,2022年06期
- 【分类号】TM46;TN322.8
- 【被引频次】1
- 【下载频次】449