【摘要】 研究提出一种新型的双级高功率脉冲磁控溅射技术，通过合理调配双级脉冲电场参数在不同N2流量条件下制备了TiN镀层并对其微观结构及性能进行分析。结果表明，随着N2流量由10mL/min逐渐增加至40mL/min时，TiN镀层的择优取向由（111）晶面逐渐转变为（220）晶面、表面形貌由多方向棱角的锥状结构转变为紧密结合的圆胞状结构，镀层均呈现柱状晶的生长方式且平均晶粒尺寸为纳米级，当氮气流量为20 mL/min时镀层N/Ti原子比最接近标准值1，镀层组织结构最为致密且具有最优的力学性能和膜基结合性能；同时，利用新型的双级高功率脉冲磁控溅射技术可有效改善传统高功率脉冲磁控溅射平均沉积速率较低的技术缺憾，当N2流量为20 mL/min时可达到46.35 nm/min。更多还原

【Abstract】 A new dual-stage high power pulsed magnetron sputtering technology was proposed. The TiN coating was prepared by reasonably adjusting the parameters of the two-stage pulsed electric field under different N₂ flow conditions, and its microstructure and performance were analyzed. The results show that as the N₂ flow rate gradually increases from 10 mL/min to 40 mL/min, the preferred orientation of the TiN coating gradually changes from（111） to（220） crystal plane. The surface morphology of the coating changes from a multi-directional angular cone structure to a tightly combined round-cell structure. The coatings all present the growth mode of columnar crystals and the average crystal grain size is nanometers. When the N₂ flow rate is 20 mL/min, the N/Ti atomic ratio of the coating is closest to the standard value of 1, and the coating structure is the densest and has the best mechanical properties and film-base bonding properties. At the same time, the use of new dual-stage high-power pulsed magnetron sputtering process can effectively improve the technical shortcomings of traditional high-power pulsed magnetron sputtering with a low average deposition rate. When the N₂ flow rate is 20 mL/min, it can reach 46.35 nm/min.更多还原