【摘要】 为了提高传感器用PCB环氧树脂板的表面性能，利用次磷酸钠体系在其表面进行真空蒸镀铜。选择苯亚磺酸钠(SBS)与聚乙烯亚胺(PEI)作为添加剂来分析其对镀铜层性能的影响，获得更适合真空蒸镀铜工艺的添加剂。研究结果表明：在65℃下持续沉铜0.5 h,综合沉积率以及板面颜色，确定最优含量PEI为16～28 mg/L,SBS为54～62 mg/L,真空蒸镀铜温度为40～50℃。镀液都在基本接近的20 min时间开始析出铜，添加组合添加剂的真空蒸镀铜液持续时间最长，表现出了最优的稳定性。添加剂优化了镀层的组织结构，使得颗粒尺寸更加细小，并且孔洞数量也明显降低，形成了更加致密的结构，晶粒外形也更平整。采用组合添加剂制备的镀层相对于以单独添加剂制备的镀层的孔隙率更小，镀层性能更优。更多还原

【Abstract】 In order to improve the surface performance of PCB epoxy resin board for sensor, sodium hypophosphate system was used for vacuum evaporation copper plating on its surface. Sodium benzenesulfonate SBS and polyethylenimine PEI were selected as additives to analyze their influence on the performance of copper plating layer, and the suitable additives for vacuum evaporation copper plating process were obtained. Results showed that the optimal content of PEI was 16～28 mg/L, that of SBS was 54～62 mg/L, and the vacuum evaporation copper plating temperature was 40～50 ℃ under the condition of continuous deposition of copper for 0.5 h at 65 ℃, based on the deposition rate and plate color. Copper was precipitated from the plating solution at approximately 20 min, and the vacuum evaporation copper plating solution with combined additives had the longest duration and showed the optimal stability. With additives, the coating had better microstructure and particle size became finer, and the number of holes decreased significantly, resulting in a denser structure and a smoother grain shape. The coating prepared by the combined additive had smaller porosity and better performance than that prepared by the single additive.更多还原