【摘要】 采用快速凝固与热锻相结合的方法,制备组织均匀、晶粒细小的Cu-0.15Zr（质量分数,%）合金,研究高温退火过程中合金显微组织演变、力学性能和电导率。该合金表现出良好的热稳定性,即使在700°C退火2 h后,合金强度仅轻微下降。退火过程中纳米级连续分布的Cu₅Zr析出相对位错运动起到钉扎作用,从而使基体强化,同时,尺寸较大的颗粒状Cu₅Zr析出相通过钉扎晶界阻碍晶粒长大。在700°C退火2 h后,由于空位、位错、晶界以及基体中溶质Zr原子减少,合金电导率达到峰值88%（IACS）。更多还原

【Abstract】 Cu-0.15Zr （wt.%） alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging.Evolution of microstructure,mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated.The alloy exhibits good thermal stability,and its strength decreases slightly even after annealing at 700℃ for 2 h.The nano-sized Cu₅Zr precipitates show significant pinning effect on dislocation moving,which is the main reason for the high strength of the alloy.Additionally,the large-size Cu₅Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing.After annealing at 700℃ for 2 h,the electrical conductivity of samples reaches the peak value of 88%（IACS）,which is attributed to the decrease of vacancy defects,dislocations,grain boundaries and Zr solutes.更多还原