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Effects of post-annealing on crystalline and transport properties of Bi2Te3 thin films

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【作者】 郭奇勋任中旭黄意雅郑志超王学敏何为朱振东滕蛟

【Author】 Qi-Xun Guo;Zhong-Xu Ren;Yi-Ya Huang;Zhi-Chao Zheng;Xue-Min Wang;Wei He;Zhen-Dong Zhu;Jiao Teng;Department of Material Physics and Chemistry, University of Science and Technology Beijing;Collaborative Innovation Center of Advanced Steel Technology, University of Science and Technology Beijing;Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences;National Institute of Metrology;

【通讯作者】 朱振东;滕蛟;

【机构】 Department of Material Physics and Chemistry, University of Science and Technology BeijingCollaborative Innovation Center of Advanced Steel Technology, University of Science and Technology BeijingBeijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of SciencesNational Institute of Metrology

【摘要】 A well-established method is highly desirable for growing topological insulator thin films with low carrier density on a wafer-level scale. Here, we present a simple, scalable method based on magnetron sputtering to obtain high-quality Bi2 Te3 films with the carrier density down to 4.0 × 1013 cm-2. In contrast to the most-used method of high substrate temperature growth, we firstly sputtered Bi2 Te3 thin films at room temperature and then applied post-annealing. It enables the growth of highly-oriented Bi2 Te3 thin films with larger grain size and smoother interface. The results of electrical transport show that it has a lower carrier density as well as a larger coherent length(~ 228 nm, 2 K). Our studies pave the way toward large-scale, cost-effective production of Bi2 Te3 thin films to be integrated with other materials in wafer-level scale for electronic and spintronic applications.

【Abstract】 A well-established method is highly desirable for growing topological insulator thin films with low carrier density on a wafer-level scale. Here, we present a simple, scalable method based on magnetron sputtering to obtain high-quality Bi2 Te3 films with the carrier density down to 4.0 × 1013 cm-2. In contrast to the most-used method of high substrate temperature growth, we firstly sputtered Bi2 Te3 thin films at room temperature and then applied post-annealing. It enables the growth of highly-oriented Bi2 Te3 thin films with larger grain size and smoother interface. The results of electrical transport show that it has a lower carrier density as well as a larger coherent length(~ 228 nm, 2 K). Our studies pave the way toward large-scale, cost-effective production of Bi2 Te3 thin films to be integrated with other materials in wafer-level scale for electronic and spintronic applications.

【基金】 supported by the National Natural Science Foundation of China (Grant Nos. 52072030, 52071025, and 51871018);the Beijing Outstanding Young Scientists Projects (Grant No. BJJWZYJH01201910005018);Beijing Natural Science Foundation,China (Grant No. Z180014);the Science and Technology Innovation Team Program of Foshan (Grant No. FSOAA-KJ919-4402-0087);Beijing Laboratory of Metallic Materials and Processing for Modern Transportation
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2021年06期
  • 【分类号】O484.4
  • 【下载频次】21
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