【摘要】 随着厚铜多层PCB在电子产品上应用的不断增多,其可加工性及热可靠性倍受关注,文章针对厚铜多层PCB的使用特点,从其基板材料入手,分析与研究了影响板材热膨胀系数、层间粘合力及树脂填充等特性的因素,利用高填充及增韧手段,使板材获得低的热膨胀系数及高的粘合力,并在厚铜多层PCB应用中具备良好的适应性。更多还原

【Abstract】 With the increasing application of heavy copper multilayer PCBs in electronic product, its workability and thermal reliability have attracted much attention. This article aims at the characteristics of heavy copper multilayer PCBs, and studies the factors affecting the thermal expansion coefficient, interlayer adhesion and resin filling of the board. With the combination of high level filler loading and toughening methods, the board can obtain low thermal expansion coefficient and high adhesion, which can well match the application of heavy copper multilayer PCB.更多还原