【摘要】 对近五年来具有低介电常数与低介质损耗的不同聚合物材料(聚酰亚胺、全氟环丁基聚合物、苯并噁嗪基聚合物以及苯并环丁烯树脂等)的研究进展进行综述,重点探讨不同聚合物材料的结构设计策略(化学组成、分子结构以及孔结构等)对材料各项性能(介电性能、吸水性、热稳定性、力学性能等)的影响,并简单分析其中的影响机理。最后,总结了不同低介电聚合物材料设计的4种共性方法(降低分子极性、增加分子自由体积、引入多孔结构以及引入交联结构),并展望了未来低介电聚合物材料的发展方向。更多还原

【Abstract】 The research progresses of different polymers(polyimide, perfluorocyclobutyl-based polymer,benzoxazinyl polymer, benzocyclobutene resin, etc.) with low dielectric constant and low dielectric loss factor in recent five years were reviewed. The influence of different design strategies of polymer structures(chemical composition, molecular structure, pore structure, etc.) on their properties(dielectric properties, water absorption,thermal stability, mechanical properties, etc.) was discussed mainly, and the influencing mechanisms were analyzed briefly. At last, the four common methods(reducing molecular polarity, increasing the free volume of molecular, introducing porous structure, and introducing cross-linking structures) for the design of different low dielectric polymers were summarized, and the development direction of low dielectric polymers in future was prospected.更多还原