【摘要】 本文介绍了NB-IoT与LoRa等低功率广域网络技术在已经实施的项目中出现终端功耗过高、接入容量过低、网络可靠性不足等方面的问题。并提出了融合mMIMO和长距离窄带传输,以免许可mMIMO随机接入(mGFRA)技术为核心的TurMass技术及其在提升接入容量的特点。基于TurMass技术SoC芯片的模块化设计整合了射频电路与数字基带SoC,所设计的射频芯片通过55nm RFCMOS工艺进行流片验证。点对点测试与系统测试结果表明,芯片发射端的信道发射功率21.5dBm,减去接收灵敏度-140.7dBm的链路预算为162.2dBm,表示可以容忍的最大路径损耗,具有无线网络覆盖较远的特点,并且完成测试确认没有丢包的情况发生。更多还原

【Abstract】 This paper introduces the problems of LPWAN technologies such as NB-IoT and LoRa in the implemented projects,including terminal power consumption is too high,low access capacity,lack of network reliability,etc.TurMass technology integrates MIMO and long-distance narrow-band transmission and Grant-Free Random Access with massive MIMO(mGFRA) technologies and its characteristics in improving access capacity.The modular design of SoC chip based on TurMass technology integrates RF circuit and digital baseband SoC.The designed RF chip was validated by 55 nm RFCMOS process.The results of point-to-point test and system test show that the link budget of transmitting power 21.5 dbm minus receiving sensitivity-140.7 dbm is 162.2 dbm,which means the maximum path loss that can be tolerated,along with the characteristic of long range wireless network coverage and complete the test to confirm that there is no packet loss.更多还原