【摘要】 针对Sn58Bi钎料高温易粗化与脆性的问题,采用感应熔炼方法制备钎料,研究了Ag, Sb元素添加对Sn58Bi钎料时效处理前后的组织与维氏硬度的影响。结果表明,Sn58Bi钎料在时效过程中,树枝晶Bi元素扩散进入等轴晶的Bi相中,进而造成了钎料组织的粗化;Ag的添加可细化组织、提高钎料时效处理前后的钎料硬度,Sb的添加可细化时效前组织并降低时效处理前后的钎料硬度,而Ag和Sb的共同添加使组织的粗化,并降低时效前硬度、提高时效后硬度。更多还原

【Abstract】 Aiming at the problem of easy coarsening and brittleness at high temperature for Sn58 Bi solder, the solder was prepared by induction melting. The influence of Ag and Sb elements on the morphology and Vickers hardness of Sn58 Bi solder after aging treatment was studied. The results showed that during the aging process of Sn58 Bi solder, the Bi element of dendritic crystal diffused into the Bi phase of equiaxial crystal, thus causing the coarsening of solder microstructure. The addition of Ag could refine the structure and improve the solder hardness before and after aging treatment, the addition of Sb could refine the solder structure and reduce the solder hardness before and after aging treatment, while the joint addition of Ag and Sb could coarsene the microstructure, and reduced the welded hardness and improved the aging hardness.更多还原