【摘要】 本文使用COMSOL Multiphysics软件对常功率平面热源法进行了仿真。我们选用热导率相差较大的氧化硅、有机玻璃和气凝胶作为仿真研究的试样,只要选择合适的尺寸参数和时间参数,则仿真结果得到的导温系数a、热导率κ和恒压比热c与试样已知的参数即可以符合得很好。仿真结果表明,常功率平面热源法的理论模型与实际的热传导过程相符。我们在热学课堂上引入常功率平面热源法的仿真,引起了学生广泛的兴趣,不但在有限的时间内形象地展示了热传导过程及其应用,还让学生有学习的冲动,提高学生自己获取知识的能力,培养学生对物理学和现代科技的兴趣。更多还原

【Abstract】 In this paper, COMSOL Multiphysics software was used to simulate the plane heat source method with constant heat rate. Silica, polymethyl methacrylate(PMMA) and aerogel, with much different thermal conductivity, were chosen as the samples for simulation study. When the size and time were chosen appropriately, the thermal diffusivity a, thermal conductivity κ and constant pressure specific heat c obtained from the simulation results were very close to the known parameters of these samples. The simulation results showed that the theoretical model of plane heat source method with constant heat rate was consistent with the actual thermal conduction process. We introduced the simulation in thermodynamic course. It had aroused many students’ interest. The simulation showed the thermal conduction process and its application in a limited time and let students have the impulse to learn. It resulted to improve students’ ability to acquire knowledge by themselves, and to improve students’ interest in physics and modern science and technology.更多还原