【摘要】 综述了5G通讯对于覆铜板介电性能、热性能和阻燃性能的要求及高频/高速覆铜板用树脂基体的优缺点，重点介绍了苯并口恶嗪用于覆铜板的研究进展。苯并口恶嗪树脂具有出色的耐热性和阻燃性、优异的尺寸稳定性及低的介电常数和介电损耗，在电子元器件中得到广泛应用。通过对其进行分子设计改性、纳米材料改性和共聚共混改性可进一步提高其介电性能、热性能和阻燃性，从而作为高性能树脂基体或黏合剂分别应用于刚性和挠性覆铜板中。最后根据5G高频/高速覆铜板的市场需求，对苯并口恶嗪树脂的应用进行了展望。更多还原

【Abstract】 The requirements of 5 G communication on the dielectric properties, thermal properties and flame retardancy of copper clad laminates were reviewed. The advantages and disadvantages of the resin matrix for high frequency/high speed copper clad laminates were compared. The research progress of benzoxazine used in copper clad laminate was mainly introduced. Benzoxazine has excellent heat resistance and flame retardancy, excellent dimensional stability, low dielectric constant and dielectric loss, and was widely used in electronic components. Modification of molecular design and nanomaterials or copolymerization can further improve its dielectric properties, thermal properties and flame retardancy, thus can be used as high-performance resin matrix or adhesive in rigid copper clad laminate and flexible copper clad laminate, respectively. Finally, according to the market demands of high frequency/high speed copper clad laminates, the applications of benzoxazine resin were prospected.更多还原