节点文献
柔性基金属互联线路的卷对卷制备工艺
Roll-to-Roll Preparation of Flexible Metal Interconnect Conductor
【摘要】 使用以喷墨印刷为基础的印制电子技术来制备柔性金属互联线路时,喷头易堵塞,制备的导体线路精度差,且需要高温处理。针对这些问题,文中提出了一种可靠且低成本的柔性基金属互联线路制备工艺。该方法结合卷对卷印刷工艺和化学沉积技术来制备金属互联线路,使用的柔性基底材料是具有比普通纸更好的强度和耐水性的Teslin纸。使用卷对卷柔版印刷机在柔性基底材料上印刷出互联线路图案,通过紫外固化技术对基底上的墨膜进行干燥,采用化学沉积技术在基底表面上得到金属铜导体。该工艺的优势是制备的导体精度高且不需要高温固化。此外,由于使用卷对卷柔印机,因此具有工业上大规模流水化生产的前景。文中使用SEM、XRD、EDS和附着力测试证明了本文所制备的柔性金属互联线路的金属层表面具有致密、结晶度高、附着力好、电阻率低(2.62×10-8Ω·cm)且机械性能良好(1 000次弯曲)等优点。
【Abstract】 For the problems of the current flexible metal interconnect conductor based on the inkjet printing-based printed electronics technology, such as easy clogging of nozzles, poor accuracy of conductor lines, and the process requires heating, a reliable and low-cost flexible metal interconnect conductor is proposed, which is the method of preparing metal interconnect conductor by combining the roll-to-roll printing process and the chemical deposition technique. The flexible substrate material used herein is Teslin paper, which has more excellent mechanical strength and water resistance than ordinary paper. A roll-to-roll flexography machine is used to print the metal interconnect conductor pattern on the flexible substrate material. The ink film on the substrate is dried by ultraviolet curing technology, and the metal copper conductor is obtained on the substrate surface by chemical deposition technology. The advantage of this craft is that the prepared metal copper conductor has high accuracy and the process do not require high temperature equipment. In addition, since a roll-to-roll flexography printing machine is utilized, it has the prospect of large-scale flow production in the industry. The SEM, XRD, EDS and adhesion test of the metal layer of the metal interconnect conductor prove that the surface of the metal layer of the interconnect conductor has advantages including dense surface, high crystallinity, good adhesion, low resistivity(2.62×10-8Ω·cm), and excellent mechanical properties(1 000 bending test).
【Key words】 printed electronics; paper substrate; roll-to-roll flexography; chemical deposition; metal interconnect conductor; UV curing; flexibility; RFID label;
- 【文献出处】 电子科技 ,Electronic Science and Technology , 编辑部邮箱 ,2021年07期
- 【分类号】TN05
- 【下载频次】149