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便携式机箱内部PCB间微带线的耦合特性分析

Analysis of Coupling Characteristics of Microstrip Line on PCB inside Portable Chassis

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【作者】 吴其霖; 谭康伯; 路宏敏;

【Author】 WU Qilin;TAN Kangbo;LU Hongmin;School of Electronic Engineering,Xidian University;

【机构】 西安电子科技大学电子工程学院;

【摘要】 针对在便携式机箱狭小内部空间中相接各个模块,承担着信息能量传输交换功能PCB上的微带线存在电磁耦合干扰问题,提出了基于模型化简的建模仿真分析方法。文中将机箱模型建模并基于微绕理论简化模型,结合机箱内部PCB及其上微带线的电磁特征建模,并在微带线上添加相应的时钟信号激励和负载,实现了不用PCB间微带线的耦合特性仿真分析。结果表明,当与干扰PCB相对空间位置为垂直或平行时,微带线的耦合电压峰值分别为1.3 mV和0.5 mV,整体变化趋势与时钟信号上升下降沿相关;垂直和平行PCB上的耦合电压分别呈正相关和负相关关系。

【Abstract】 A modeling and simulation analysis method based on model simplification is proposed to solve the problem of electromagnetic coupling interference in the microstrip line of PCB, which is connected to each module in the small interior of the portable chassis and is responsible for the function of information energy transmission and exchange. In this paper, the chassis model is modeled and simplified according to the micro-winding theory. Combined with the electromagnetic model modeling of the PCB inside the chassis and the microstrip line on it, and the adding of corresponding clock signal excitation and load on the microstrip line,the simulation analysis of the coupling characteristics of the microstrip line without PCB is realized. The results show that when the relative spatial position of the interference PCB is perpendicular or parallel, the coupling voltage peaks of the microstrip line are 1.3 mv and 0.5 mv, respectively. The overall change trend is related to the rising and falling edge of clock signal, and the coupling voltage on the vertical and parallel PCB is positively and negatively correlated, respectively.

【基金】 国家自然科学基金(3187040582)~~
  • 【文献出处】 电子科技 ,Electronic Science and Technology , 编辑部邮箱 ,2021年03期
  • 【分类号】TN41
  • 【下载频次】85
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