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化学镀在微道沟填充技术中的应用
Application of electroless plating in bottom-up filling technology for submicro-trenches
【摘要】 归纳了在不同化学镀体系中利用单组分添加剂和双组分添加剂来实现超级化学镀填充技术的研究进展。阐述了聚二硫二丙基磺酸钠、N,N-二甲基硫代氨基甲酰基丙烷磺酸钠、聚乙二醇等添加剂对微孔或微道沟填充的作用机制,为今后实现更窄的微孔和微道沟的完美填充提供方法和策略。
【Abstract】 The research progress of using single-component and two-component additives in the electroless plating systems to realize the superfilling was summarized. The action mechanisms of different additives such as bis(3-sulfopropyl)disulfide, 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid, and poly(ethylene glycol) on the superfilling of microholes or microtrenches were described. Some effective approaches and strategies to achieve superfilling of narrower microholes and microtrenches in the future were provided.
【关键词】 化学镀;
超级填充;
添加剂;
作用机制;
综述;
【Key words】 electroless plating; bottom-up superfilling; additive; action mechanism; review;
【Key words】 electroless plating; bottom-up superfilling; additive; action mechanism; review;
【基金】 陕西省自然科学基础研究计划项目(2020JQ-792);陕西省教育厅重点科学研究计划项目(20JS153);延安大学校级大学生创新创业训练计划项目(D2019012);延安大学科研计划项目(YDY2019-24)
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2021年17期
- 【分类号】TG174.4
- 【下载频次】134