【摘要】 含硅芳炔树脂(PSAs)因其突出的耐热性能,在诸多领域具有应用价值。为满足高速发展的航空航天、电子信息技术的应用需求,耐高温树脂材料性能亟待提升。本研究以1,3-二乙炔基苯和苯基二氯硅烷为原料,通过格氏试剂法合成线型聚(苯基硅烷-芳炔)树脂(PPSA),对其交联固化形成耐高温结构的机理进行研究。采用差示扫描量热仪(DSC)与热重分析(TGA)对其热固化行为和热稳定性进行表征,采用傅里叶变换红外光谱仪(FTIR)和裂解气质联用(Py-GC-MS)对PPSA树脂耐高温结构的形成机理进行研究。实验证明,PPSA树脂在热固化过程中通过环三聚反应、Diels-Alder反应和硅氢加成反应生成苯环、萘环和菲环等类芳环结构,赋予了PPSA固化物优异的耐高温性能,其热分解温度(Td5)为742～755℃,1000℃热解残留率大于92%。因此,PPSA对拓宽含硅芳炔的应用具有重要意义。更多还原

【Abstract】 Silicon-containing arylacetylene resins(PSAs)are promising thermal stability polymers for applications.The rapid development of aerospace and electronic information puts forward higher requirements for PSAs.Novel linear poly(phenylsilane-arylacetylene)resins(PPSA)were prepared through condensation reaction of arylacetyl-Grignard reagents and phenylchlorosilane.The thermal curing behavior and thermostability were studied by differential scanning calorimetry(DSC)and thermogravimetric analysis(TGA).The curing mechanism was investigated by Fourier transform infrared(FTIR)and pyrolysis-gas chromatographymass spectrometry(Py-GC-MS).The results revealed that phenyl,naphthyl and phenanthryl derivatives were formed by cyclotrimerization,Diels-Alder reaction and hydrosilation reaction during the curing process.The formed aromatic fused rings endowed the cured PPSA with excellent thermal stability,and the temperature at5% weight loss(Td5)of the cured resins ranged from 742℃to 755℃,and the char yield at 1000℃ was above92%.Therefore,PPSA resins are of great significance to broaden the application of PSAs.更多还原