【摘要】 研究陶瓷与6061铝合金烧结封接工艺及其结合机制。将Al₂O₃陶瓷进行表面化学镀镍,再与6061铝合金进行烧结封接,在不同烧结温度下观察Al₂O₃（N）陶瓷/6061铝合金接头微观形貌,并选取在590℃、1 h下获得的接头进行EDS分析,测定不同温度下烧结Al₂O₃（N）陶瓷/6061铝合金接头强度。研究表明,所制Al₂O₃陶瓷表面化学镀镍层均匀致密,铝合金中元素扩散至化学镀镍层,自铝合金一侧至陶瓷一侧,Al元素含量整体上呈先减小后增大的趋势;随着烧结温度的升高,接头强度也随之升高,最大可达15.4 MPa。更多还原

【Abstract】 This paper makes a study of the sintering process of sealing the ceramic with 6061 aluminum alloy and its binding mechanism. Electroless nickel plating is done on Al₂O₃ ceramic surface,then sintering and sealing is with 6061 aluminum alloy. The microstructure of 6061 aluminum alloy/Al₂O₃（ N） ceramic is observed at different sintering temperature conditions and EDS analysis is performed on the joints at 590 ℃、1 h. The bonding strength is tested at different temperatures conditions. It is found that the nickel layer on the ceramic surface is uniform and compact and the elements in the aluminum alloy spread to the electroless nickel plating layer. From the aluminum alloy side to the ceramic side,the content of Al element first decreases and then increases. With the sintering temperature rise,the joint strength also increases,up to 15.4 MPa.更多还原