【摘要】 NiPt合金溅射靶材是半导体工业制备NiPtSi接触层的重要原材料。本文对NiPt5合金在冷轧过程中的结构演变及磁性能进行研究。结果表明:NiPt5合金在冷轧过程中微观结构的演变经历位错缠结、位错壁、含小角晶界的拉长亚晶粒、新晶界形成4个阶段。晶粒细化主要是位错的聚集、湮灭和重排所导致。NiPt5的矫顽力随着轧制变形量的增加而增加,这归因于冷轧诱导的缺陷及内应力对畴壁移动的阻碍。剩磁与NiPt5合金择优取向密切相关,(200)织构导致剩磁升高。Ni合金较高的磁各向异性使á200?取向的织构对提高靶材质量十分有利。更多还原

【Abstract】 Nickel-platinum(Ni Pt) alloy sputtering target was used in semiconductor industries for the formation of Ni-Pt-silicide to realize the contact and interconnection function. The microstructure evolution and magnetic properties of NiPt5 alloy were studied during cold-rolling process. The results show that, during the cold-rolling process, the microstructure evolution of NiPt5 alloy includes four stages: dislocation entanglement, dislocation wall, elongated sub-grain with small angle grain boundary, and the formation of new grain boundary. The grain refinement is mainly attributed to the accumulation, annihilation and rearrangement of dislocations. The coercivity of NiPt5 increases with increasing the rolling deformation, which is attributed to the defects and internal stress induced by cold rolling that can obstruct the movement of domain wall. The remanence is closely related to the preferred orientation of the NiPt5 alloy.(200) plane texture leads to the increase of remanence. The high magnetic anisotropy of Ni alloy makes ?200? plane texture enable to improve the quality of target material.更多还原