【摘要】 采用光学显微镜、扫描电镜、电子探针、透射电镜和拉伸实验研究稀土Ce对含Pb杂铜显微组织和力学性能的影响。透射电镜和能谱分析表明,Ce与Pb形成球状CePb₃颗粒,粒径约3.6μm,均匀分布在铜基体中。CePb₃与铜基体的错配度较低（约4.62%）,可以作为有效成核质点,有利于晶粒细化。Pb存在于晶界会恶化铜的力学性能,Cu-0.1Pb的抗拉强度和伸长率分别比纯铜降低43.1%和56.7%。Ce加入能净化铜的晶界,形成CePb₃第二相颗粒,细化晶粒尺寸,提高铜的力学性能。与Cu-0.1Pb相比,Cu-0.1Pb-0.3Ce的抗拉强度（179MPa）和伸长率（38.5%）分别提高117.6%和151.6%。更多还原

【Abstract】 The effects of rare earth Ce on the microstructure and mechanical properties of impure copper containing Pb were investigated using OM, SEM, EPMA, TEM and tensile testing. TEM and EDS analysis reveal that spherical CePb₃ particles form after Ce addition. CePb₃ particles, with average size of ～3.6 μm, homogenously distribute in the Cu matrix. Due to small lattice misfit（～4.62%） with Cu matrix, CePb₃ particles can act as effective nucleation sites beneficial to the grain refinement. Pb at grain boundaries seriously deteriorates the mechanical properties of Cu. The tensile strength and the elongation of Cu-0.1 Pb are decreased by 43.1% and 56.7% compared with those of pure copper, respectively. Ce can purify grain boundaries, cause the precipitation of CePb₃ particles and refine grain sizes, which contribute to significant improvement of the mechanical properties of Cu. Compared with Cu-0.1Pb, the tensile strength（179 MPa） and the elongation（38.5%） of Cu-0.1Pb-0.3Ce are increased by 117.6% and 151.6%, respectively.更多还原