【摘要】 使用γ-氨丙基三乙氧基硅烷（KH550）对硅微粉（SiO₂）进行表面改性得到改性硅微粉（mSiO₂）,以聚乙烯接枝甲基丙烯酸缩水甘油酯（PE-g-GMA）为相容剂,以SiO₂或mSiO₂为导热填料,低密度聚乙烯（LDPE）为基体,制备了高绝缘性导热低密度聚乙烯复合材料。对导热填料进行结构分析,对复合材料的微观形貌、绝缘性能、导热性能、力学性能等进行分析。结果表明,KH550已经成功接到了硅微粉表面,相容剂添加量在3%时,mSiO₂/LDPE复合材料的电气强度为35.1 kV/mm,体积电阻率为3.63×10¹⁵Ω·cm,导热系数为0.72 W/（m·K）,拉伸强度为15.2 MPa。更多还原

【Abstract】 Taking polyethylene-glycidyl methacrylate（ PE-g-GMA） as compatibilizer,silicon micronized powder（ SiO₂） or modified silicon micronized powder（ mSiO₂） as a thermally conductive filler and low density polyethylene（ LDPE） as a matrix,a high-insulation thermally conductive low-density polyethylene composite material was prepared by using m SiO₂ which was obtained by using γ-aminopropyl triethoxysilane（ KH550） to modify SiO₂.The structure of thermally conductive fillers was analyzed,and the micro-morphology,insulation performance,thermal conductivity and mechanical properties of the composite materials were analyzed.The results show that KH550 has been successfully connected to the surface of silicon micronized powder.When the content of the compatibilizer is 3%,the breakdown voltage of the composite material is 35.1 kV/mm,the volume resistivity is 3.63× 10¹⁵Ω·cm,and the thermal conductivity is 0.72 W/（ m·K）,the tensile strength is 15.2 MPa.更多还原