【摘要】 以半导体材料为基础的微电子技术正面临尺寸极限和功耗的双重挑战与发展瓶颈.低温电子学作为突破上述瓶颈的新兴应用研究学科之一,得到科研和产业界越来越多的关注.2017年起,低温电子学和量子信息处理被国际器件与系统路线图(IRDS)列为重点关注的十大焦点领域之一.以低温到室温的微弱、高频电信号传输为核心的跨温区互联技术是低温电子学和量子信息处理必须解决的关键技术之一.本文对跨温区互联面临的主要问题与挑战、目前的进展和未来展望进行了综述,为我国开展相关研究工作提供参考.更多还原

【Abstract】 Microelectronictechnology based on semiconductor materials is facing the dual challenges and development bottlenecksof size limit and power consumption. As one of the emerging applied research disciplines that breaking through the abovementioned bottleneck, cryogenic electronics has attracted more and more attention from scientific research and industry. Since 2017, cryogenic electronicsand quantum information processing have been listed as one of the topten focus areas on International Roadmap For Devices And Systems(IRDS). The cross-temperature interconnection technology with weak, high-frequency electrical signal transmission from low temperature to room temperature as the core is one of the key technologies that must be solved in cryogenic electronics and quantum information processing. This article summarizes the main problems and challenges faced by the inter-temperature zone interconnection, the current progress and future prospects, and provides references for ourcountry to carry out related research work.更多还原