【摘要】 采用还原氨浸工艺实现电镀污泥中铜、镍的浸出。在20%（质量分数）氨水+0.3 mol/L （NH₄）₂CO₃+0.4 mol/L Na₂SO₃的浸出体系中,当固液比为1∶15,在70℃下浸出3h,铜、镍的浸出率别为95.84%和90.12%。反应动力学分析表明,氨-碳酸铵-亚硫酸钠体系浸出电镀污泥中铜、镍受界面传质和固体膜层扩散共同控制。更多还原

【Abstract】 Copper and nickel were leached from electroplating sludge in a reductive ammonia medium. The leaching efficiencies was 95.84% for copper and 90.12% for nickel under the following conditions: ammonia 20 wt.%,（NH₄）₂CO₃ 0.3 mol/L, Na₂SO₃ 0.4 mol/L, solid-to-liquid ratio 1:15, temperature 70℃, and reaction time 3 h. The analysis of reaction kinetics showed that the leaching of copper and nickel from electroplating sludge in the ammonia–ammonium carbonate– sodium sulfite medium is controlled by interfacial mass transfer and solid membrane diffusion.更多还原