【摘要】 以氧化钇稳定氧化锆陶瓷(Yttria-stabilized zirconia)为加工材料,对陶瓷片的微孔激光加工过程进行单因素试验,探究功率因子、扫描速度及重复频率等参数对微孔侧面间隙及圆度等评价指标的影响规律。鉴于各参数对评价指标的影响存在差异,无法通过改变单参数来获得最优的加工质量,设计了四因素四水平正交试验,对加工参数进行分析和优化。根据正交试验结果进行综合选择,得到的优化组合加工参数如下:功率因子为70%、重复频率为50 kHz、扫描速度为19μm/s、扫描间距为25μm。按优化后参数加工的热障涂层微孔成型较为理想。更多还原

【Abstract】 Taking Yttria-stabilized zirconia as the processing material, a single-factor test was conducted to investigate the influence of power factor, scanning speed and repetition frequency on the evaluation indexes such as side clearance and roundness for the microvia laser processing of ceramic chips.Within the range of selected machining parameters, the level of influence of each parameter on the evaluation objective varies, and the optimal machining quality cannot be obtained by increasing and decreasing a single parameter.The orthogonal test was designed to analyze and optimize the processing parameters. According to the orthogonal test analysis results, the optimized combination of processing parameters are: power factor of 70%, repetition frequency of 50 kHz, scanning speed of 19 μm/s and scanning distance of 25 μm. The thermal barrier coating microporous effect by using the optimized parameters is more ideal.更多还原