节点文献
Charge trapping memory device based on the Ga2O3 films as trapping and blocking layer
【摘要】 We present a new charge trapping memory(CTM) device with the Au/Ga2O3/SiO2/Si structure, which is fabricated by using the magnetron sputtering, high-temperature annealing, and vacuum evaporation techniques. Transmission electron microscopy diagrams show that the thickness of the SiO2 tunneling layer can be controlled by the annealing temperature.When the devices are annealed at 760℃, the measured C–V hysteresis curves exhibit a maximum 6 V memory window under a ±13 V sweeping voltage. In addition, a slight degradation of the device voltage and capacitance indicates the robust retention properties of flat-band voltage and high/low state capacitance. These distinctive advantages are attributed to oxygen vacancies and inter-diffusion layers, which play a critical role in the charge trapping process.
【Abstract】 We present a new charge trapping memory(CTM) device with the Au/Ga2O3/SiO2/Si structure, which is fabricated by using the magnetron sputtering, high-temperature annealing, and vacuum evaporation techniques. Transmission electron microscopy diagrams show that the thickness of the SiO2 tunneling layer can be controlled by the annealing temperature.When the devices are annealed at 760℃, the measured C–V hysteresis curves exhibit a maximum 6 V memory window under a ±13 V sweeping voltage. In addition, a slight degradation of the device voltage and capacitance indicates the robust retention properties of flat-band voltage and high/low state capacitance. These distinctive advantages are attributed to oxygen vacancies and inter-diffusion layers, which play a critical role in the charge trapping process.
【Key words】 charge trapping memory; SiO2 tunneling layer; annealing temperature;
- 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2019年10期
- 【分类号】TP333
- 【下载频次】25