节点文献
大功率半导体激光器热沉技术研究
Research on heat sink technology of high-power semiconductor laser
【摘要】 文章选取AuSn过渡热沉替代原来的In焊料,克服了In焊料引起的器件寿命使用偏低、针对激光器结温影响大等缺点,并对过渡热沉的结构设计和焊接工艺做了进一步研究,设计出新型AuSn过渡热沉的焊装结构。经过结温—漏电流测试可以得到更为优良的散热效果,外推寿命从6 134 h提高到20 363 h,提高了器件的可靠性。
【Abstract】 In this paper, AuSn heat sink is selected to replace the original in solder to overcome the shortcomings of solder, such as low device life and great influence on laser junction temperature, and a new welding structure of AuSn heat sink is designed. Through the test of junction temperature and leakage current, better heat dissipation effect can be obtained. The extrapolation life can be increased from 6 134 hour to 20 363 hour, the reliability of the device is improved.
【关键词】 大功率半导体激光器;
AuSn;
过渡热沉;
结温;
【Key words】 high power semiconductor laser; AuSn; transition heat sink; junction temperature;
【Key words】 high power semiconductor laser; AuSn; transition heat sink; junction temperature;
- 【文献出处】 无线互联科技 ,Wireless Internet Technology , 编辑部邮箱 ,2019年23期
- 【分类号】TN248.4
- 【下载频次】327