【摘要】 以铜粉作为导热填料,75Ga25In液态金属为导热基体,制备了一系列液态金属导热膏。通过扫描电子显微镜（SEM）对导热填料进行了表征,研究了铜粉的粒径和填充量对液态金属导热膏导热性能的影响。结果表明:当铜粉的粒径为2.5μm,填充量为12%时,液态金属导热膏的导热系数最大,为34.7W·（m·K）^-1,显著高于市售普通导热硅脂。铜粉与液态金属复合既能获得高的导热系数,又能降低液态金属的流动性,提高其涂敷性能。更多还原

【Abstract】 In this paper,a series of liquid metal thermal conductive paste is prepared with copper powder as a thermal conductive filler and 75 Ga25 In liquid metal as the thermal conductive matrix.The thermal conductive fillers were characterized by SEM.The effects of particle size and filling amount of copper powder on the thermal conductivity of liquid metal thermal conductive paste were studied.The results show that when the particle size of copper powder is 2.5μm and the filling volume ratio is 12%,the thermal conductivity of liquid metal thermal conductive paste reaches the largest value of 34.7 W·（m·K）^-1,which is significantly higher than that of the marketed ordinary thermal conductive silicone.The combination of copper powder and liquid metal can not only achieve high thermal conductivity,but also reduce the fluidity of liquid metal and improve its coating performance.更多还原